capabilities roadmap
Calumet Electronics has been manufacturing printed circuit boards in the USA since 1968. Over the years we have learned a lot about making boards and building partnerships. Mission-critical manufacturing maintains the process capability required to produce highly-reliable printed boards with dock-to-stock performance you can rely on. The following capability matrix is a snapshot of current, developing and planned process capabilities.
| STANDARD | ADVANCED | EMERGING | |
|---|---|---|---|
| Circuit Layers | 1 – 20 | 22 + | 32 + |
| Circuit Trace/Space | 0.003″/0.003″ | 0.002″/0.002″ | <0.002″/0.002″ |
| Minimum Thickness | 0.014″ | 0.014″ | 0.014″ |
| Minimum Finished Core Thickness | 0.003″ | 0.002″ | 0.001″ |
| Min Drilled Hole Thickness (Mechanical) | 0.0079″ | 0.0059″ | 0.0059″ |
| Blind Vias | Yes | Yes | Yes |
| Microvias | Yes | Yes | Yes |
| Microvia Aspect Ratio | 1:1 | > 1:1 | > 1:1 |
| Sequential Lamination / Buried Vias | Yes (3-4 Lamination Cycles) | Yes (> 4 Lamination Cycles) | Yes (> 4 Lamination Cycles) |
| Copper Weight (Inner) | 0.5-4oz Foil | 0.5-5oz Foil | 0.5-5oz Foil |
| Copper Weight (Outer) | 0.25-3oz Foil | 0.25-4oz Foil | 0.25-4oz Foil |
| Copper Weight (Finished) | Up to 5oz. Plated | Up to 5oz. Plated | Up to 5oz. Plated |
| Hole Aspect Ratio | 14:1 | 16:1 | 18:1 |
| BGA Pitch | 0.0137″ / 0.35mm | < 0.35mm | < 0.35mm |
| Tin/Lead Solder Finish | 63/37 SnPb HASL | 63/37 SnPb HASL | 63/37 SnPb HASL |
| Lead-Free Solder Finish | SN100C HASL | SN100C HASL | SN100C HASL |
| Immersion Gold Finish | per IPC-4552 | per IPC-4552 | per IPC-4552 |
| Immersion Silver Finish | per IPC-4553 (Thick) | per IPC-4553 (Thick) | per IPC-4553 (Thick) |
| Carbon Ink | Yes | Yes | Yes |
| Controlled Impedance | 10% | < 10% | < 10% |
| Largest Panel Size | 19.5″ x 22.5″ | 19.5″ x 22.5″ | 19.5″ x 22.5″ |
| Via Hole Plugging (Non-conductive) | Yes | Yes | Yes |
| Via Hole Plugging (Conductive) | Yes | Yes | Yes |
| Via Planarization / Via In Pad | Yes | Yes | Yes |
| Castellations / Edge Plating | Yes | Yes | Yes |
| RF / Mixed Builds | Yes | Yes | Yes |
Please contact us for further updates and/or specific interests.
