introducing america's

smallest, lightest, fastest pcbs

enable next-gen electronics

go beyond subtractive processing

Dramatically increase in PCB circuit density with 1 mil (25µm) trace enabling high-density fanout with 0.4mm pitch BGA.

Improve RF performance over subtractive-etch processes. Improved SI with ratios greater than 1:1 for metal traces.

Dramatically decrease size and weight and increase density while improving reliability and reducing cost.

Current U.S. Capability

Current Asia Capability

new calumet capability

Limitations of U.S. Subtractive Processes
New capabilities at Calumet Electronics
3 mil (75µm) trace/space, trapezoidal traces
1 mil (25µm) trace/space, straight sidewalls
1.0mm BGAs, up to 4 fanout traces, 3 mil (75µm)
0.4mm BGAs, up to 6 fanout traces, 1 mil (25 µm)
mSAP 1µm/3.0µm base copper
A-SAP™ 0.25µm copper seed layer
Limited copper feature formation
High frequency passives, transmission lines, and waveguides